| CPC H01L 25/0753 (2013.01) [H01L 33/0093 (2020.05); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] | 12 Claims |

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1. A display panel, comprising:
a circuit substrate; and
a plurality of micro light-emitting diode structures, each comprising:
a micro light-emitting chip, electrically bonded to the circuit substrate and comprising:
a first surface, located on a side of the micro light-emitting chip facing the circuit substrate;
a second surface, disposed opposite to the first surface; and
a peripheral surface, connecting the first surface and the second surface; and
a molding structure, surrounding the peripheral surface and enclosing the second surface of the micro light-emitting chip, wherein the molding structure extends in a direction away from the circuit substrate and forms an inner side wall, and the inner side wall and the second surface constitute an accommodating portion,
wherein a depth of the accommodating portion is between 3 micrometers and 10 micrometers.
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