US 12,272,672 B2
Semiconductor device with hollow interconnectors
Yi-Hsien Chou, Taoyuan (TW)
Assigned to NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed by NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on Nov. 2, 2023, as Appl. No. 18/386,349.
Application 18/386,349 is a continuation of application No. 17/560,578, filed on Dec. 23, 2021, granted, now 11,876,074.
Prior Publication US 2024/0063176 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/97 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 2224/13001 (2013.01); H01L 2224/1301 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13195 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/29001 (2013.01); H01L 2224/2901 (2013.01); H01L 2224/29011 (2013.01); H01L 2924/15311 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a package structure comprising a first side and a second side opposite to the first side, wherein the package structure further comprises a top package insulating layer defining the first side thereat, a bottom package insulating layer defining the second side thereat, and a package substrate formed between the top package insulating layer and the bottom package insulating layer;
a base structure having a first side facing toward the second side of the package structure, wherein the base structure is spaced apart from the package structure;
an interposer structure positioned over the first side of the package structure;
a first die positioned over the interposer structure;
a second die positioned over the interposer structure and adjacent to the first die; and
a plurality of bottom interconnectors positioned between the second side of the package structure and the first side of the base structure to electrically connect the package structure with the base structure via the bottom interconnectors;
a plurality of middle interconnectors positioned between the first side of the package structure and the interposer structure; wherein each of the middle interconnectors comprises a middle exterior layer coupled between the first side of the package structure and the interposer structure to electrically connect the package structure with the interposer structure via the middle interconnectors, wherein the middle exterior layer, having a barrel cross section, has a top opening and a bottom opening;
a first resist layer positioned on the first side of the package structure to encircle the bottom openings of the middle interconnectors; and
a second resist layer positioned on a bottom side of the interposer structure to encircle the top openings of the middle interconnectors.