US 12,272,669 B2
Arrangement for forming a connection
Arthur Unrau, Geseke (DE); Szabolcs Barna, Budapest (HU); Tobias Buehner, Warstein (DE); and Norbert Kanvasi, Cegléd (HU)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jan. 24, 2022, as Appl. No. 17/582,832.
Claims priority of application No. 21153174 (EP), filed on Jan. 25, 2021.
Prior Publication US 2022/0238478 A1, Jul. 28, 2022
Int. Cl. B23K 1/00 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/75 (2013.01) [B23K 1/0016 (2013.01); B23K 3/085 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75251 (2013.01); H01L 2224/755 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a solder connection, comprising:
providing an arrangement comprising:
a chamber with an outlet that is configured to generate a vacuum within the chamber;
a heating element and a cooling trap arranged in the chamber; and
a collection tray arranged below the cooling trap and configured to collect droplets of liquid falling from the cooling trap;
arranging in the chamber a first connection partner with a pre-connection layer formed thereon;
putting the chamber in a vacuum state; and
with the chamber in the vacuum state, heating the first connection partner with the pre-connection layer formed thereon with the heating element with the chamber being in the vacuum state, thereby melting the pre-connection layer,
wherein during the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap with the chamber being in the vacuum state.