US 12,272,663 B2
Metal-bump sidewall protection
Jung-Hua Chang, Hsinchu (TW); Jian-Yang He, Tainan (TW); and Chin-Fu Kao, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 28, 2022, as Appl. No. 17/815,728.
Application 17/026,983 is a division of application No. 16/176,017, filed on Oct. 31, 2018, granted, now 10,784,222, issued on Sep. 22, 2020.
Application 17/815,728 is a continuation of application No. 17/026,983, filed on Sep. 21, 2020, granted, now 11,476,219.
Prior Publication US 2022/0367397 A1, Nov. 17, 2022
Int. Cl. H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01)
CPC H01L 24/11 (2013.01) [H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01); H01L 24/10 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 25/50 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/014 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a metal bump on a first top surface of a first package component;
forming a solder region on a second top surface of the metal bump;
after the metal bump is formed, forming a protection layer extending on a sidewall of the metal bump, wherein the forming the protection layer comprises printing the protection layer, and wherein after the printing, the protection layer climbs up along the sidewall of the metal bump through capillary; and
bonding the first package component to a second package component through the solder region.