US 12,272,655 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Ji Hoon Oh, Gyeonggi-do (KR); Dong Hyun Bang, Incheon (KR); Soo Jin Shin, Gyeonggi-do (KR); Young Ik Kwon, Taichung (TW); Tae Kyeong Hwang, Seoul (KR); Min Jae Lee, Chandler, AZ (US); and Min Jae Kong, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Jul. 28, 2023, as Appl. No. 18/227,506.
Application 18/227,506 is a continuation of application No. 17/833,957, filed on Jun. 7, 2022, granted, now 11,742,300.
Application 17/833,957 is a continuation of application No. 17/002,607, filed on Aug. 25, 2020, granted, now 11,355,451, issued on Jun. 7, 2022.
Application 17/002,607 is a continuation in part of application No. 16/553,986, filed on Aug. 28, 2019, granted, now 11,004,801, issued on May 11, 2021.
Prior Publication US 2023/0369240 A1, Nov. 16, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/10 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 25/105 (2013.01); H01Q 1/2283 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising a conductive structure;
a first electronic component over the substrate;
an encapsulant over the substrate and contacting a lateral side of the first electronic component;
a shield over the encapsulant and contacting a lateral side of the encapsulant; and
a communication structure coupled with the substrate;
wherein the substrate comprises a shielded substrate section and an exposed substrate section;
wherein a first portion of the encapsulant is external to the shield; and
wherein the communication structure is external to the first portion of the encapsulant.