US 12,272,638 B2
Integrated transformer module
Takayuki Tange, Milton Keynes (GB); and Yoshimitsu Ushimi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Appl. No. 17/641,000
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
PCT Filed Oct. 7, 2020, PCT No. PCT/US2020/054514
§ 371(c)(1), (2) Date Mar. 7, 2022,
PCT Pub. No. WO2021/071900, PCT Pub. Date Apr. 15, 2021.
Claims priority of provisional application 62/912,247, filed on Oct. 8, 2019.
Prior Publication US 2022/0344260 A1, Oct. 27, 2022
Int. Cl. H01L 23/52 (2006.01); H01F 27/28 (2006.01); H01F 27/40 (2006.01); H01F 41/04 (2006.01); H01L 23/522 (2006.01); H01L 25/16 (2023.01); H10D 1/20 (2025.01); H01L 23/00 (2006.01)
CPC H01L 23/5227 (2013.01) [H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01F 41/041 (2013.01); H01L 25/16 (2013.01); H10D 1/20 (2025.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48245 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a redistribution layer including:
a metal layer;
an insulating layer; and
a magnetic component that includes a first metal winding that extends around a core and that is connected to the metal layer;
a substrate that is connected to a first side of the redistribution layer and that includes a first transistor and a second transistor; and
an electronic component connected to a second side of the redistribution layer opposite to the first side; wherein
the first metal winding is thicker than the metal layer.