US 12,272,637 B2
Integrated fan-out package with 3D magnetic core inductor
Wen-Shiang Liao, Miaoli (TW); Chih-Hang Tung, Hsinchu (TW); Chen-Hua Yu, Hsinchu (TW); Chewn-Pu Jou, Hsinchu (TW); and Feng Wei Kuo, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Feb. 12, 2021, as Appl. No. 17/174,617.
Application 17/174,617 is a division of application No. 15/897,272, filed on Feb. 15, 2018, granted, now 10,923,417.
Claims priority of provisional application 62/490,063, filed on Apr. 26, 2017.
Prior Publication US 2021/0193572 A1, Jun. 24, 2021
Int. Cl. H01L 23/522 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/5227 (2013.01) [H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/645 (2013.01); H01L 24/06 (2013.01); H01L 24/24 (2013.01); H01L 28/10 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated electronic package, comprising:
a package structure comprising multiple layers;
a first layer of the package structure comprising a molding material;
an inductor comprising an electrically conducting trace and a magnetic structure, the electrically conducting trace being disposed around the magnetic structure, the electrically conducting trace comprising trace portions at second and third layers of the package structure, the second and third layers being respectively below and above the molding material, the electrically conducting trace comprising first vias extending between the second and third layers, the first vias electrically interconnecting the trace portions to form a coil structure, the first vias of the inductor being embedded in the molding material of the first layer along with a die, the die being disposed between portions of and lying in a same plane as the inductor, the magnetic structure being disposed within the coil structure of the inductor; and
multiple electrically conducting interconnects disposed at one or more layers of the package structure, the multiple electrically conducting interconnects being connected to the die with second vias.
 
11. An integrated electronic package, comprising:
a semiconductor die comprising an integrated circuit disposed at a first layer of a package structure, the package structure comprising multiple layers, the first layer comprising a molding material;
an inductor comprising an electrically conducting trace and a magnetic structure, the die lying in a same plane as the inductor, the electrically conducting trace being disposed around the magnetic structure, the electrically conducting trace comprising trace portions at second and third layers, the second and third layers being respectively below and above the molding material, the electrically conducting trace comprising first vias extending between the second and third layers, the first vias electrically interconnecting the trace portions to form a coil structure, the first vias of the inductor being embedded in the molding material of the first layer along with the die, the magnetic structure being disposed within the coil structure of the inductor; and
multiple electrically conducting interconnects disposed at one or more layers of the package structure, the multiple electrically conducting interconnects being connected to the die with second vias, the die being disposed between portions of the inductor.
 
19. An integrated electronic package, comprising:
an inductor comprising an electrically conducting trace and a magnetic structure, the electrically conducting trace being disposed around the magnetic structure, the electrically conducting trace comprising trace portions at second and third layers of a package structure, the second and third layers being respectively below and above a molding material at a first layer of the package structure, the electrically conducting trace comprising first vias extending between the second and third layers, the first vias electrically interconnecting the trace portions to form a coil structure, the first vias of the inductor being embedded in the molding material of the first layer along with a die, the die being disposed between portions of and lying in a same plane as the inductor, the magnetic structure being disposed within the coil structure of the inductor; and
multiple electrically conducting interconnects disposed at one or more layers of the package structure, the multiple electrically conducting interconnects being connected to the die with second vias.