US 12,272,624 B2
Semiconductor device having lead connecting a semiconductor chip to a frame and projection extending from frame and a method of manufacturing semiconductor device
Masaomi Miyazawa, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Feb. 2, 2022, as Appl. No. 17/591,527.
Claims priority of application No. 2021-111610 (JP), filed on Jul. 5, 2021.
Prior Publication US 2023/0005823 A1, Jan. 5, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor chip;
a frame including an obverse surface;
a projection projecting from the obverse surface of the frame;
a lead including a back surface and a projection insertion portion into which the projection is to be inserted a portion of the back surface of the lead making direct surface contact with a portion of the obverse surface of the frame to electrically connect the semiconductor chip to the frame; and
a first bonding material configured to bond the projection to the lead.