US 12,272,619 B2
Direct liquid cooling with O-ring sealing
Jorge Padilla, Union City, CA (US); Madhusudan K. Iyengar, Foster City, CA (US); Connor Burgess, Alameda, CA (US); Padam Jain, San Jose, CA (US); Yuan Li, Sunnyvale, CA (US); and Feini Zhang, Fremont, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Oct. 21, 2022, as Appl. No. 17/971,087.
Application 17/971,087 is a continuation of application No. 16/880,417, filed on May 21, 2020, granted, now 11,488,890.
Prior Publication US 2023/0037380 A1, Feb. 9, 2023
Int. Cl. H01L 23/433 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/433 (2013.01) [H01L 25/0655 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An assembly, comprising:
a substrate having a top surface, a bottom surface and side surfaces connecting the top and bottom surfaces, the top surface of the substrate having a perimeter area free of circuitry and a central area in which circuitry is located; and
a cured-in-place gasket having a first predetermined height in an uncompressed state of the gasket disposed within the perimeter area such that a coolant delivery device sealingly engaged with the gasket may direct coolant onto the circuitry,
wherein the cured-in-place gasket is directly arranged on the top surface.