US 12,272,612 B2
Semiconductor package module and manufacturing methods thereof
Wensen Hung, Hsinchu County (TW); and Tsung-Yu Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 18, 2022, as Appl. No. 17/697,959.
Claims priority of provisional application 63/242,048, filed on Sep. 9, 2021.
Prior Publication US 2023/0071418 A1, Mar. 9, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/29 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/367 (2013.01) [H01L 23/29 (2013.01); H01L 23/528 (2013.01); H01L 24/19 (2013.01); H01L 25/0652 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package module, comprising:
a package, comprising a semiconductor die;
a conductive layer, disposed over the package; and
a heat dissipating module, disposed over the conductive layer, the package and the heat dissipating module propping against two opposite sides of the conductive layer, wherein the heat dissipating module is thermally coupled to and electrically isolated from the package through the conductive layer.