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1. An encapsulated assembly of electronic componentry incorporated inside a yarn, and the assembly embedded inside the yarn by packing fibers, and the packing fibres enclosed within a covering material or covering fibres, and the assembly comprising a flexible substrate, and a film which encapsulates the electronic componentry, the film comprising at least one relief region configured to define a volume which at least in part accommodates the electronic componentry, said relief region being flexible to define said volume by conformal relief when applied to encapsulate the componentry which is disposed on the flexible substrate, and the componentry located substantially at a neutral axis of the assembly, wherein the neutral axis being an axis at which the componentry experiences little or substantially no flexure, or only a minimum of flexure, when a bending force is applied to the assembly, and the componentry forming an elongate flexible circuit.
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