US 12,272,610 B2
Semiconductor package with stiffener
Hansung Ryu, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jan. 28, 2021, as Appl. No. 17/160,462.
Claims priority of application No. 10-2020-0103278 (KR), filed on Aug. 18, 2020.
Prior Publication US 2022/0059420 A1, Feb. 24, 2022
Int. Cl. H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/053 (2013.01) [H01L 23/3672 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a substrate having
first sides opposing each other,
and second sides opposing each other and intersecting the first sides;
a semiconductor stack mounted on the substrate, wherein the semiconductor stack defines a stack area having first edges parallel to the first sides and second edges parallel to the second sides; and
a stiffener including a plurality of frames surrounding the stack area on the substrate, wherein the plurality of the frames of the stiffener includes
first frames disposed adjacent the first sides of the substrate, spaced a first distance from the first edges of the stack area, and surrounding at least a portion of the first edges,
second frames disposed adjacent the second sides of the substrate, spaced a second distance from the second edges of the stack area, and surrounding at least a portion of the second edges, and
third frames connecting the first frames and the second frames to each other,
wherein, in plan view, the plurality of the frames of the stiffener have an octagonal shape,
wherein the first frames are spaced apart from the first sides of the substrate or the second frames are spaced apart from the second sides of the substrate, and
wherein a closest distance from (i) an intersection point between the first sides and the second sides at an outer corner of the substrate and at an upper surface of the substrate to (ii) an outer side of the third frames of the stiffener is at least 3.5 times a thickness of the substrate, wherein the thickness of the substrate is measured in a vertical direction perpendicular to the upper surface of the substrate,
wherein a width of the plurality of the frames of the stiffener is at least 20% the thickness of the substrate and less than the thickness of the substrate, wherein the width of the plurality of the frames is measured in a lateral direction parallel to the upper surface of the substrate, and
wherein the intersection point is laterally outside the plurality of frames.