US 12,272,579 B2
Substrate processing apparatus, substrate suppport and method of manufacturing semiconductor device
Yusaku Okajima, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Feb. 2, 2022, as Appl. No. 17/591,317.
Application 17/591,317 is a continuation of application No. PCT/JP2019/030919, filed on Aug. 6, 2019.
Prior Publication US 2022/0157628 A1, May 19, 2022
Int. Cl. H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67309 (2013.01) [C23C 16/401 (2013.01); C23C 16/45544 (2013.01); C23C 16/4587 (2013.01); H01L 21/02164 (2013.01); H01L 21/0228 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber in which one or more substrates are processed; and
a substrate support configured to support the one or more substrates in the process chamber,
wherein the substrate support comprises one or more plate-shaped structures arranged in the substrate support in a manner corresponding to the one or more substrates,
wherein a thickness of a central portion of a plate-shaped structure among the one or more plate-shaped structures is different from a thickness of an outer peripheral portion of the plate-shaped structure located outer of the central portion, and
wherein the outer peripheral portion of the plate-shaped structure is provided as a separate body from the central portion of the plate-shaped structure.