US 12,272,575 B2
Advanced temperature control for wafer carrier in plasma processing chamber
Fernando M. Silveira, Livermore, CA (US); Chunlei Zhang, Santa Clara, CA (US); Phillip Criminale, Livermore, CA (US); and Jaeyong Cho, Mesa, AZ (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 18, 2023, as Appl. No. 18/381,565.
Application 18/381,565 is a continuation of application No. 15/217,513, filed on Jul. 22, 2016, granted, now 11,837,479.
Claims priority of provisional application 62/332,237, filed on May 5, 2016.
Prior Publication US 2024/0047246 A1, Feb. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/67248 (2013.01) [C23C 16/46 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01J 37/3299 (2013.01); H01L 21/67017 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A workpiece processing system, comprising:
a plasma chamber;
a plasma source to generate a plasma containing gas ions in the plasma chamber;
a workpiece holder in the chamber to hold a workpiece during plasma processing and to control the temperature of the workpiece, the workpiece holder having a first fluid channel and a second fluid channel;
a first flow line coupled to the first fluid channel of the workpiece holder, the first flow line comprising a first supply flow line and a first return flow line, the first return flow line coupled to only a single return manifold;
a second flow line coupled to the second fluid channel of the workpiece holder, the second flow line comprising a second supply flow line and a second return flow line, the second return flow line coupled to only the single return manifold, the single return manifold coupled to a corresponding single heat exchanger, the single heat exchanger coupled to the first supply flow line and to the second supply flow line, wherein an entirety of an output of the first return flow line and the second return flow line is input into the single return manifold, and wherein the entirety of the output of the first return flow line and the second return flow line is the same as an entirety of an output of the first supply flow line and the second supply flow line;
a first valve coupled to the first supply flow line, the first valve between the single return manifold and the workpiece holder;
a second valve coupled to the second supply flow line, the second valve between the single return manifold and the workpiece holder;
a first flow meter between the first valve and the single return manifold, the first flow meter in series with the first valve; and
a second flow meter between the second valve and the single return manifold, the second flow meter in series with the second valve.