US 12,272,572 B2
Non-planar semiconductor packaging systems and related methods
Michael J. Seddon, Gilbert, AZ (US); and Francis J. Carney, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Dec. 28, 2023, as Appl. No. 18/398,414.
Application 18/398,414 is a continuation of application No. 16/862,294, filed on Apr. 29, 2020, granted, now 11,894,245.
Prior Publication US 2024/0145266 A1, May 2, 2024
Int. Cl. H01L 21/67 (2006.01); B21D 11/10 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67092 (2013.01) [B21D 11/10 (2013.01); H01L 21/02035 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of curving a wafer, the method comprising:
permanently coupling a curvature adjustment structure to a wafer;
inducing a curvature of a largest planar surface of the wafer through the curvature adjustment structure.