| CPC H01L 21/67069 (2013.01) [H01J 37/32146 (2013.01); H01J 37/32422 (2013.01); H01J 37/32449 (2013.01); H01J 37/32623 (2013.01); H01J 37/32724 (2013.01); H01J 37/32972 (2013.01); H01J 37/3299 (2013.01); H01L 21/31138 (2013.01); B08B 5/023 (2013.01); H01J 37/321 (2013.01); H01J 2237/334 (2013.01)] | 19 Claims |

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1. A gas distribution device for etching a substrate in a substrate processing system, comprising:
an annular side wall;
a flange extending radially outwardly from one end of the annular side wall;
a plate defining a dual gas plenum extending between and enclosing an opposite end of the annular side wall and including a plasma-exposed side directly exposed to plasma and a substrate-facing side;
a first gas channel arranged in the annular side wall around a periphery of the dual gas plenum;
a plurality of connecting gas channels extending along parallel chords through the dual gas plenum between opposite sides of the first gas channel;
a second gas channel extending horizontally from a radially outer surface of the flange into the flange;
a third gas channel extending vertically through the annular side wall and including:
a first end in fluid communication with a first end of the second gas channel; and
a second end directly connected to the first gas channel;
a first plurality of through holes extending from the plurality of connecting gas channels through the substrate-facing side of the dual gas plenum; and
a second plurality of through holes extending from the plasma-exposed side of the dual gas plenum to the substrate-facing side of the dual gas plenum, a plurality of rows of the second plurality of through holes arranged between adjacent ones of the plurality of connecting gas channels.
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