US 12,272,569 B2
Apparatus for treating substrate and temperature control method
Sang Min Lee, Seoul (KR); Young Hun Lee, Cheonan-si (KR); and Myung Seok Cha, Seoul (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 9, 2021, as Appl. No. 17/547,182.
Claims priority of application No. 10-2020-0172541 (KR), filed on Dec. 10, 2020.
Prior Publication US 2022/0189795 A1, Jun. 16, 2022
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67034 (2013.01) [H01L 21/67109 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a chamber having a treating space for treating a substrate;
a fluid supply unit configured to supply a treating fluid to the treating space; and
a controller,
wherein the fluid supply unit comprises:
a tank having an inner space;
a first supply line supplying the treating fluid to the inner space;
a second supply line transferring the treating fluid from the inner space to the treating space;
a temperature controlling member configured to control a temperature of the inner space; and
a pressure measuring member configured to measure a pressure of the inner space, and
wherein the controller controls the temperature controlling member to control the temperature of the inner space, based on a measured pressure of the inner space measured by the pressure measuring member.