| CPC H01L 21/02282 (2013.01) [B05C 11/02 (2013.01); B05C 11/08 (2013.01); B05D 1/005 (2013.01); H01L 21/02126 (2013.01); H01L 21/02137 (2013.01); H01L 21/6715 (2013.01)] | 20 Claims |

|
1. A method of manufacturing a semiconductor device, comprising:
dispensing liquid spin on glass (SOG) from a dispenser nozzle, wherein dispensing the liquid SOG comprises dispensing the liquid SOG from a suck back (SB) valve, and the SB valve comprises:
a switch valve configured to permit the liquid SOG to flow from a SOG supply toward the dispenser nozzle, and
an adjustment valve configured to force the liquid SOG toward the dispenser nozzle in response to closing the adjustment valve, wherein the adjustment valve is downstream from the switch valve;
ceasing dispensing liquid SOG from the dispenser nozzle;
detecting, using a sensor, the liquid SOG outside of the dispenser nozzle in an abnormal length relative to the dispenser nozzle;
adjusting, using a controller, the SB valve to withdraw liquid SOG from the abnormal length, wherein adjusting the SB valve comprises closing the switch valve and opening the adjustment valve;
comparing a sensed amount of liquid SOG outside of the dispenser nozzle, but still connected to the dispenser nozzle, with at least one set operating parameter; and
pausing sensing of liquid SOG outside of the dispensing nozzle for a duration based on the sensed amount of liquid SOG being outside the at least one operating parameter.
|