US 12,272,521 B2
Plasma sources and plasma processing apparatus thereof
Vladimir Nagorny, Tracy, CA (US); Wei Liu, San Jose, CA (US); and Rene George, San Carlos, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 19, 2023, as Appl. No. 18/199,780.
Application 18/199,780 is a continuation of application No. 17/149,254, filed on Jan. 14, 2021, granted, now 11,658,006.
Prior Publication US 2023/0369017 A1, Nov. 16, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/3211 (2013.01) [H01J 37/3244 (2013.01); H01J 2237/332 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A plasma source, comprising:
a sidewall defining a plasma source interior volume, the sidewall coupled with an edge gas injection port, the edge gas injection port being disposed perpendicular to the sidewall and surrounded by a circular plenum;
a gas injection insert disposed within the plasma source interior volume, the gas injection insert defining a gas injection channel proximate the sidewall;
a first induction coil disposed at a first position adjacent the sidewall and disposed around the sidewall;
a first radio frequency power generator coupled with the first induction coil;
a second induction coil disposed at a second position adjacent the sidewall and disposed around the sidewall, wherein the second position is below the first position and is at a bottom ⅓ height of the plasma source; and
a second radio frequency power generator coupled with the second induction coil.