| CPC H01H 59/0009 (2013.01) [B81C 1/00246 (2013.01); H01H 1/0036 (2013.01); H01H 57/00 (2013.01); H01L 21/8221 (2013.01); H01L 27/0617 (2013.01); H01L 27/0688 (2013.01); B81B 2201/018 (2013.01); B81C 2203/0735 (2013.01); B81C 2203/0771 (2013.01); H01H 2001/0068 (2013.01); H01H 2001/0078 (2013.01); H01H 2059/0054 (2013.01); H01L 23/522 (2013.01); H01L 2924/0002 (2013.01)] | 19 Claims |

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1. A method, comprising:
applying a first potential to a first part of a structure of a switching device, the switching device comprising:
a beam held by the structure at a beam pivot point, the beam having a beam contact region, the structure being substantially symmetrical with respect to the beam pivot point, the beam extending in a cavity of a back end of line region of a semiconductor device, the back end of line region comprising a plurality of metallization levels disposed in one or more insulating layers; and
a first contact region extending into the cavity adjacent the beam, a same metallization level of the plurality of metallization levels comprising the beam, the structure, and the first contact region; and
pivoting the beam at the beam pivot point, in a first direction in response to the applying of the first potential, causing the beam contact region to pivot to physically and electrically contact the first contact region.
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