US 12,272,483 B2
Electronic module
Yi-Cheng Lin, Hsinchu (TW)
Assigned to CYNTEC CO., LTD., Hsinchu (TW)
Filed by CYNTEC CO., LTD., Hsinchu (TW)
Filed on Apr. 28, 2022, as Appl. No. 17/731,267.
Claims priority of provisional application 63/180,659, filed on Apr. 28, 2021.
Prior Publication US 2022/0353994 A1, Nov. 3, 2022
Int. Cl. H05K 1/18 (2006.01); H01F 27/02 (2006.01); H01F 27/245 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 27/32 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H05K 3/28 (2006.01)
CPC H01F 27/255 (2013.01) [H01F 27/022 (2013.01); H01F 27/245 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/306 (2013.01); H01F 27/323 (2013.01); H01F 41/0233 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H05K 1/18 (2013.01); H05K 3/284 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/10037 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic module, comprising:
a circuit board;
a plurality of electrical components, disposed on a first surface of the circuit board and electrically connected to the circuit board;
a molding body, disposed on the first surface of the circuit board to encapsulate the plurality of electrical components, wherein a first recess is formed in the molding body; and
a first electrode, electrically coupled to the circuit board, wherein at least one portion of an electrode of an external component is disposed in the first recess and electrically connected to the first electrode of the electronic module, wherein the first electrode forms a partial portion of the entire bottom surface of the first recess.