US 12,272,480 B2
Packaged inductive component
Ralf Grieger, Soest (DE); and Hugues Njiende, Paderborn (DE)
Assigned to DELTA ELECTRONICS (THAILAND) PCL., Samutprakarn (TH)
Filed by Delta Electronics (Thailand) Public Co., Ltd, Samutprakarn (TH)
Filed on Jan. 7, 2020, as Appl. No. 16/735,736.
Prior Publication US 2020/0234868 A1, Jul. 23, 2020
Int. Cl. H01F 27/22 (2006.01); H01F 27/02 (2006.01); H01F 41/02 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H01F 27/22 (2013.01) [H01F 27/022 (2013.01); H01F 41/02 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01)] 14 Claims
OG exemplary drawing
 
1. Packaged inductive component, comprising:
an inductive element and
an electrically insulating packaging enclosing the inductive element, the packaging comprising:
a first area consisting of a thermally conductive material, wherein the first area is connected to the inductive element by a thermally conductive adhesive, wherein the first area has a first surface being an outside surface of the packaged inductive component, and
a second area consisting of a thermally insulating material,
wherein the packaging further comprises a casing surrounding the second area, wherein the first area is connected with the casing via another adhesive arranged between the first area and the casing, wherein the first area is connected with the casing via the other adhesive arranged between the first area and an inner protrusion of the casing, and/or via the other adhesive arranged between the first area and a short or long outer protrusion of the casing, and/or via the other adhesive arranged between the first area and an upper protrusion of the casing.