US 12,272,406 B2
Page buffer circuits in memory devices
E-Yuan Chang, Chiayi (TW); and Ji-Yu Hung, Toufen (TW)
Assigned to Macronix International Co., Ltd., Hsinchu (TW)
Filed by Macronix International Co., Ltd., Hsinchu (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/150,594.
Prior Publication US 2024/0233832 A1, Jul. 11, 2024
Int. Cl. G11C 16/00 (2006.01); G11C 16/24 (2006.01)
CPC G11C 16/24 (2013.01) 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a memory cell array comprising memory cells;
a page buffer circuit comprising a plurality of page buffers coupled to the memory cell array, each page buffer comprising a plurality of latches and an internal data line (IDL) arranged to couple to the plurality of latches; and
a cache circuit comprising a plurality of caches,
wherein the IDLs of the plurality of page buffers are configured to be conductively connected together in series to form a data bus (DBUS) that conductively connects the page buffer circuit to the cache circuit for data transfer.