US 12,272,403 B2
Memory device configured to reduce degradation of adjacent word lines and operating method thereof
Myoung-Ho Son, Gyeonggi-do (KR); Doo-Yeun Jung, Suwon-si (KR); and Sung-Kwan Jung, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 29, 2022, as Appl. No. 17/955,733.
Claims priority of application No. 10-2022-0005440 (KR), filed on Jan. 13, 2022; and application No. 10-2022-0057453 (KR), filed on May 10, 2022.
Prior Publication US 2023/0223082 A1, Jul. 13, 2023
Int. Cl. G11C 16/08 (2006.01); G11C 16/16 (2006.01); G11C 29/12 (2006.01); G11C 16/04 (2006.01)
CPC G11C 16/08 (2013.01) [G11C 16/16 (2013.01); G11C 29/12 (2013.01); G11C 16/0483 (2013.01); G11C 2029/1202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An operating method of a memory device, comprising:
acquiring an address of a first bad word line, the first bad word line included in a plurality of word lines of the memory device;
detecting whether word lines adjacent to the first bad word line are bad based on the address of the first bad word line, the word lines adjacent to the first bad word line included in the plurality of word lines;
designating a first word line among the word lines adjacent to the first bad word line as a prohibited word line, the first word line being detected as a second bad word line; and
sending first data via a second word line detected as a normal word line among the word lines adjacent to the first bad word line using a first voltage that is lower than a second voltage used to program normal word lines, the normal word lines being one or more of the plurality of word lines excluding the word lines adjacent to the first bad word line.