US 12,272,294 B2
Active control of light emitting diodes and light emitting diode displays
Christopher P. Hussell, Cary, NC (US); Boris Dzyubenko, Morrisville, NC (US); and Colin Blakely, Raleigh, NC (US)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Apr. 11, 2019, as Appl. No. 16/381,116.
Application 16/381,116 is a continuation of application No. 16/369,003, filed on Mar. 29, 2019, granted, now 11,727,857.
Prior Publication US 2020/0309357 A1, Oct. 1, 2020
Int. Cl. G09G 3/32 (2016.01); F21V 23/00 (2015.01); F21V 23/06 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H03K 7/08 (2006.01); H05B 45/37 (2020.01); H05B 45/50 (2022.01)
CPC G09G 3/32 (2013.01) [F21V 23/007 (2013.01); F21V 23/06 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H03K 7/08 (2013.01); H05B 45/37 (2020.01); H05B 45/50 (2020.01)] 8 Claims
OG exemplary drawing
 
1. A light emitting diode (LED) pixel, comprising:
a submount comprising a first face and a second face that is opposite the first face, wherein the second face of the submount forms a primary emission face of the LED pixel;
at least one LED comprising a light-emitting face that is mounted on the first face of the submount;
an active electrical element mounted on the first face of the submount, wherein the active electrical element is configured to alter a driving condition of the at least one LED according to input signals received from an external source, wherein the active electrical element is further configured to monitor, store, and output one or more operating conditions of the LED pixel to the external source, and wherein electrical connections for the active electrical element comprise bond pads that are on a primary mounting face of the LED pixel, wherein the at least one LED and the active electrical element are arranged between the submount and the primary mounting face of the LED pixel; and
an encapsulant layer on the submount, wherein the encapsulant layer only covers portions of the at least one LED that are outside the light-emitting face of the at least one LED, the encapsulant layer covers portions of the active electrical element, and the encapsulant layer is arranged between the submount and the bond pads.