US 12,271,111 B2
Template, manufacturing method of template, and manufacturing method of semiconductor device
Takahiro Iwasaki, Yokohama Kanagawa (JP); Hirokazu Miyoshi, Kamakura Kanagawa (JP); Shogo Aso, Yokohama Kanagawa (JP); and Masayuki Hatano, Yokohama Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Mar. 2, 2021, as Appl. No. 17/190,083.
Claims priority of application No. 2020-153713 (JP), filed on Sep. 14, 2020.
Prior Publication US 2022/0082934 A1, Mar. 17, 2022
Int. Cl. G03F 7/00 (2006.01); B29C 33/38 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0002 (2013.01) [B29C 33/3842 (2013.01); H01L 21/0271 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An imprint template, comprising:
a substrate with a first surface and a mesa part protruding from the first surface, the mesa part having a second surface with a pattern thereon, wherein
the mesa part includes a sloped region, the second surface in the sloped region sloping downward towards the first surface to an outer edge of the mesa part when the substrate is in a non-pressurized state,
at least a portion of the pattern is in the sloped region,
the mesa part includes a flat region,
the sloped region is an outer circumferential region of the second surface,
the flat region is surrounded by the sloped region, and
when an area of the flat region is a value S1 and an area of the sloped region projected to a plane parallel to the flat region is a value S2, then a ratio of the value S2 to the total of the values S1 and S2 is greater than zero but less than or equal to 0.2.