US 12,271,079 B2
Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same
Cheol Hun Lee, Gyeonggi-do (KR); Do Hyoung Kwon, Gyeonggi-do (KR); and Sung Jin Noh, Gyeonggi-do (KR)
Assigned to DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR)
Filed by DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR)
Filed on Aug. 9, 2022, as Appl. No. 17/883,864.
Claims priority of application No. 10-2021-0104330 (KR), filed on Aug. 9, 2021.
Prior Publication US 2023/0038765 A1, Feb. 9, 2023
Int. Cl. G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H05K 1/11 (2006.01)
CPC G02F 1/133612 (2021.01) [G02F 1/133601 (2021.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H05K 1/111 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A circuit board for a light-emitting diode assembly, the circuit board comprising:
a substrate layer;
dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads;
a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle comprising wirings connected to the LED landing pads at the same level; and
an insulating layer formed on the substrate layer to cover the wiring bundle, the insulating layer including an opening partially exposing each of the LED landing pads,
wherein a plurality of dimming zones neighboring in the column direction of the dimming zones to form a dimming zone column, and a plurality of the dimming zone columns are arranged in the row direction,
wherein the wiring bundle comprise at least two common wirings commonly connected to a plurality of dimming zones among the dimming zones; and
an individual wiring connected to each of the dimming zones,
wherein a double-layered structure consisting of a single-layered conductive circuit layer including the LED landing pads and the wiring bundle, and a single-layered insulating layer is stacked on the one surface of the substrate layer,
wherein the circuit board further comprises an intermediate layer formed between the conductive circuit layer and the substrate layer.