US 12,271,027 B2
Optical circuit board and electronic component mounting structure using same
Yoshinori Nakatomi, Nagahama (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 17/629,155
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed May 12, 2020, PCT No. PCT/JP2020/018986
§ 371(c)(1), (2) Date Jan. 21, 2022,
PCT Pub. No. WO2021/014720, PCT Pub. Date Jan. 28, 2021.
Claims priority of application No. 2019-136935 (JP), filed on Jul. 25, 2019.
Prior Publication US 2022/0268998 A1, Aug. 25, 2022
Int. Cl. G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/126 (2006.01)
CPC G02B 6/12004 (2013.01) [G02B 6/122 (2013.01); G02B 2006/12061 (2013.01); G02B 6/126 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An optical circuit board comprising:
a planar wiring board including a mounting portion in which an electrode is disposed; and
an optical waveguide located on a surface of the wiring board, wherein
the optical waveguide comprises a lower cladding layer, a core, and an upper cladding layer that are disposed in this order from the wiring board,
the lower cladding layer comprises a first region extending to at least a pair of peripheries facing each other of the mounting portion and comprising an opening portion exposing the electrode, and a second region in which the core and the upper cladding layer are disposed in this order, the second region being adjacent to the first region,
the core comprises an exposed portion in which the upper cladding layer is not disposed in the first region, and the exposed portion is adjacent to the second region,
at least one supporting member is disposed in a circumference edge portion of the opening portion in the lower cladding layer in the mounting portion and is located on an opposite side of the second region away from the exposed portion, and
a difference between a height of the supporting member and a height of the exposed portion in the core is 5% or less of a height of the core.