US 12,270,970 B2
Direct-bonded lamination for improved image clarity in optical devices
Belgacem Haba, Saratoga, CA (US); Rajesh Katkar, Milpitas, CA (US); and Ilyas Mohammed, San Jose, CA (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Jan. 28, 2022, as Appl. No. 17/587,921.
Application 17/587,921 is a continuation of application No. 16/176,191, filed on Oct. 31, 2018, granted, now 11,256,004.
Claims priority of provisional application 62/645,633, filed on Mar. 20, 2018.
Prior Publication US 2022/0155490 A1, May 19, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 1/10 (2015.01); G02B 1/02 (2006.01); G02B 27/01 (2006.01); F21V 8/00 (2006.01)
CPC G02B 1/10 (2013.01) [G02B 1/02 (2013.01); G02B 27/0172 (2013.01); G02B 6/0055 (2013.01); G02B 2027/0178 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A method of forming a mirrored optical waveguide, the method comprising:
depositing one or more reflective coatings on at least a first optically transparent substrate, wherein the one or more reflective coatings is at least partially reflective;
providing an inorganic dielectric layer over the one or more reflective coatings, the inorganic dielectric layer forming a first surface of the first optically transparent substrate;
providing a second optically transparent substrate having a second surface;
placing the first surface and the second surface together to form a stack;
forming a refractory interface via a direct bond between the first surface and the second surface at room temperature, wherein the refractory interface has a same coefficient of thermal expansion as a coefficient of thermal expansion of at least one of the first surface or the second surface; and
dicing the stack at an oblique angle to a perpendicular of the one or more reflective coatings.