US 12,270,944 B2
Laser scanning apparatus
Fei Zhao, Wuhan (CN); and Li Zeng, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Apr. 7, 2021, as Appl. No. 17/224,974.
Application 17/224,974 is a continuation of application No. PCT/CN2020/097295, filed on Jun. 20, 2020.
Claims priority of application No. 201910725611.5 (CN), filed on Aug. 7, 2019.
Prior Publication US 2021/0223370 A1, Jul. 22, 2021
Int. Cl. G01S 7/48 (2006.01); G01S 7/481 (2006.01); G01S 17/42 (2006.01); G01S 17/58 (2006.01); G02B 26/10 (2006.01); G02B 27/09 (2006.01)
CPC G01S 7/4817 (2013.01) [G01S 17/42 (2013.01); G01S 17/58 (2013.01); G02B 26/105 (2013.01); G02B 27/095 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a scanning micromirror chip comprising a scanning micromirror, a laser, and a detector configured to detect an echo beam;
a packaging shell, located on the scanning micromirror chip, and forming a hollow structure with the scanning micromirror chip, wherein the laser and detector are located in the hollow structure; and
a packaging component located in the hollow structure and fixed on the packaging shell, the packaging component configured to collimate and reflect a beam emitted by the laser, and to emit an output beam to the scanning micromirror,
wherein the echo beam is a beam reflected back after the output beam reaches a target object.