US 12,270,933 B2
Radar apparatus
Yusuke Tainaka, Kariya (JP); Akira Shintai, Kariya (JP); and Shinji Kawano, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Jan. 3, 2022, as Appl. No. 17/646,786.
Application 17/646,786 is a continuation of application No. PCT/JP2020/023021, filed on Jun. 11, 2020.
Claims priority of application No. 2019-125992 (JP), filed on Jul. 5, 2019.
Prior Publication US 2022/0128650 A1, Apr. 28, 2022
Int. Cl. G01S 7/03 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01)
CPC G01S 7/032 (2013.01) [H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A radar apparatus comprising:
a board;
a high-frequency integrated circuit mounted to the board;
a shielding case configured to enclose the high-frequency integrated circuit, the high-frequency integrated circuit having a surface that faces the shielding case;
a radio-absorbing and heat-dissipative gel arranged to cover at least part of the high-frequency integrated circuit and to be in contact with the shielding case; and
a metallic housing located outside the shielding case,
wherein
at least part of the radio-absorbing and heat-dissipative gel being in contact with the surface of the high-frequency integrated circuit, and
the radio-absorbing and heat-dissipative gel being arranged to directly transfer heat generated from the high-frequency integrated circuit to the shielding case.