US 12,270,850 B2
Semiconductor device testing with lead extender
Soon Lai Kho, Malacca (MY); and Nee Wan Khoo, Melaka (MY)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 8, 2023, as Appl. No. 18/119,076.
Prior Publication US 2024/0302426 A1, Sep. 12, 2024
Int. Cl. G01R 31/26 (2020.01)
CPC G01R 31/2601 (2013.01) 20 Claims
OG exemplary drawing
 
1. A method of testing a semiconductor device, the method comprising:
providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body;
providing a semiconductor device testing apparatus comprising a package holder, a plurality of contact test probes, and a lead extender;
arranging the semiconductor package within the package holder;
actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and
applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.