| CPC G01P 1/006 (2013.01) [G01P 15/0802 (2013.01); B81B 7/0087 (2013.01); G01P 21/00 (2013.01); H01L 23/34 (2013.01)] | 15 Claims |

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1. A sensor system, comprising:
a chip arrangement including a sensor and an acceleration sensor; and
a processor circuit configured in such a way that:
one or multiple temperature-dependent variables and/or properties of the sensor are ascertained, and
an offset of a signal of the acceleration sensor induced by a temperature gradient is corrected with using the one or the multiple ascertained temperature-dependent variables and/or properties of the sensor,
wherein the chip arrangement includes an ASIC structure,
wherein the ASIC structure includes an integrated temperature sensor configured to measure a temperature of the ASIC structure to thereby ascertain the temperature gradient between the chip arrangement and the ASIC structure.
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