US 12,270,709 B2
Infrared sensor
Tzong-Sheng Lee, Ping Cheng (TW); Jen-Wei Luo, Ping Cheng (TW); Chia-Hao Weng, Ping Cheng (TW); Chun-Chi Lin, Ping Cheng (TW); Ting-Chun Hsu, Ping Cheng (TW); Hui-Jou Yu, Ping Cheng (TW); Yi-Hung Lin, Ping Cheng (TW); and Sung-Hung Lin, Ping Cheng (TW)
Assigned to TXC CORPORATION, Taipei (TW)
Filed by TXC CORPORATION, Taipei (TW)
Filed on May 25, 2021, as Appl. No. 17/329,366.
Claims priority of application No. 110203732 (TW), filed on Apr. 7, 2021.
Prior Publication US 2022/0326085 A1, Oct. 13, 2022
Int. Cl. G01J 5/068 (2022.01)
CPC G01J 5/068 (2022.01) 10 Claims
OG exemplary drawing
 
1. An infrared sensor comprising:
a substrate;
an infrared sensing chip fixed to the substrate;
a metal cover, fixed to the substrate, having an opening; and
an infrared lens, fixed to the metal cover, covering the opening;
wherein the substrate, the metal cover, and the infrared lens form a vacuum chamber;
wherein the infrared sensing chip is arranged in the vacuum chamber;
wherein a thickness of the infrared lens is less than a height of a space surrounded by the metal cover and arranged over the opening that communicates with the space and the infrared lens is arranged in the space;
wherein the infrared lens has an infrared filtering function and a focusing function;
wherein a top surface of the metal cover is higher than a top surface of the infrared lens and the metal cover has an inverted U-shape in cross section.