US 12,270,609 B2
Heat dissipation member and electronic apparatus
Lianming Guo, Beijing (CN); and Huajun Dong, Beijing (CN)
Assigned to LENOVO (BEIJING) LIMITED, Beijing (CN)
Filed by Lenovo (Beijing) Limited, Beijing (CN)
Filed on Mar. 11, 2022, as Appl. No. 17/693,028.
Claims priority of application No. 202110956680.4 (CN), filed on Aug. 19, 2021.
Prior Publication US 2023/0065452 A1, Mar. 2, 2023
Int. Cl. F28D 15/04 (2006.01); H05K 7/20 (2006.01)
CPC F28D 15/046 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20336 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A heat dissipation member, comprising:
a condensation area arranged away from a heating element of an electronic apparatus in an application state;
an evaporation area arranged close to the heating element in the application state; and
a capillary structure layer, a capillary force of the capillary structure layer in the evaporation area being greater than a capillary force of the capillary structure layer in the condensation area;
wherein:
the heat dissipation member is a heat pipe, including a plurality of heat dissipation chambers, a heat dissipation medium being arranged in the heat dissipation chambers, and the capillary structure layer being arranged at chamber bodies of the heat dissipation chambers;
the heat pipe includes a number n annular pipe bodies, an i-th annular pipe body being nested at an outside of an (i−1)-th annular pipe body, hollow chambers among the number n annular pipe bodies accommodating a heat dissipation medium, i and n being integers greater than 1, and i being less than or equal to n; and
the number n annular pipe bodies are provided with the capillary structure layer.