US 12,270,207 B2
Sound damping wallboard and method of constructing a sound damping wallboard
Stephen A. Cusa, Downingtown, PA (US); Michael N. Blades, Indian Land, SC (US); Richard P. Weir, Indian Trail, NC (US); and John W. Mixson, Charlotte, NC (US)
Assigned to Gold Bond Building Products, LLC, Charlotte, NC (US)
Filed by Gold Bond Building Products, LLC, Charlotte, NC (US)
Filed on Aug. 23, 2023, as Appl. No. 18/454,179.
Application 18/454,179 is a continuation of application No. 15/017,362, filed on Feb. 5, 2016, granted, now 11,746,534.
Claims priority of provisional application 62/112,560, filed on Feb. 5, 2015.
Prior Publication US 2023/0399855 A1, Dec. 14, 2023
Int. Cl. E04B 1/86 (2006.01); E04B 1/99 (2006.01); E04F 13/08 (2006.01); E04F 13/14 (2006.01); E04B 1/84 (2006.01)
CPC E04F 13/0867 (2013.01) [E04B 1/86 (2013.01); E04B 1/99 (2013.01); E04F 13/0875 (2013.01); E04F 13/14 (2013.01); E04B 2001/8461 (2013.01); E04F 2290/043 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method for forming a sound damping wallboard, comprising: providing a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, the gypsum layer having a first encasing layer disposed at the gypsum layer outer surface and a third encasing layer disposed at the gypsum layer inner surface; applying a sound damping layer to the third encasing layer such that the sound damping layer includes a sound damping layer inner surface opposite the gypsum layer inner surface; and providing a second encasing layer at the sound damping layer inner surface, wherein the second encasing layer is formed of a material comprising paper, fiberglass, foil, or a polymer; wherein, when attached to an installed wallboard, the sound damping layer is disposed between the gypsum layer and the installed wallboard.