| CPC C25D 17/004 (2013.01) [C25D 17/02 (2013.01); C25D 17/28 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01)] | 20 Claims |

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1. A plating apparatus for performing plating treatment on a substrate, comprising:
a tank body comprising at least one side wall, the at least one side wall being provided with an opening extending from an inside to an outside of the tank body, the tank body being configured to accommodate a plating solution;
a fixing device configured to fix the substrate to the outside of the tank body at the opening of the at least one side wall;
at least one sealing element disposed around the opening; and
a cleaning module coupled to the plating apparatus for cleaning the at least one sealing element, wherein the cleaning module comprises a plate assembly and a roller assembly coupled together, wherein the plate assembly provides a mechanical support to the roller assembly and the roller assembly is configured to clean the at least one sealing element, and
wherein the roller assembly comprises a feeder roller for supplying a fresh tape to the at least one sealing element and a receiver roller for receiving a contaminated tape from the at least one sealing element, wherein the fresh tape is turned into the contaminated tape for cleaning the at least one sealing element.
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