US 12,270,111 B2
Methods for producing an etch resist pattern on a metallic surface
Nava Shpaisman, Kedumim (IL); and Moshe Frenkel, Jerusalem (IL)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on Oct. 10, 2023, as Appl. No. 18/483,673.
Application 18/483,673 is a continuation of application No. 17/647,756, filed on Jan. 12, 2022, granted, now 11,807,947.
Application 17/647,756 is a continuation of application No. 16/948,597, filed on Sep. 24, 2020, granted, now 11,255,018, issued on Feb. 22, 2022.
Application 16/948,597 is a continuation of application No. 15/751,866, granted, now 10,806,035, issued on Oct. 13, 2020, previously published as PCT/IL2016/050820, filed on Jul. 27, 2016.
Claims priority of provisional application 62/204,508, filed on Aug. 13, 2015.
Prior Publication US 2024/0035167 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C23F 1/02 (2006.01); B41M 5/00 (2006.01); C09D 11/101 (2014.01); C09D 11/30 (2014.01); C23F 1/00 (2006.01); G03F 1/50 (2012.01); G03F 7/20 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H10K 71/13 (2023.01)
CPC C23F 1/02 (2013.01) [B41M 5/0058 (2013.01); C09D 11/101 (2013.01); C09D 11/30 (2013.01); C23F 1/00 (2013.01); G03F 1/50 (2013.01); G03F 7/2018 (2013.01); H05K 3/0002 (2013.01); H05K 3/0017 (2013.01); H05K 3/0079 (2013.01); H05K 3/061 (2013.01); H10K 71/13 (2023.02); H10K 71/135 (2023.02); H05K 2203/013 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/1173 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a metallic pattern on a metallic object, the method comprising:
chemically activating a metallic object by exposing the metallic object to an aqueous solution containing a compound selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide, to form metal ions;
after chemically activating the metallic object, printing onto the activated metallic object, in a pattern, a liquid containing a polymeric component comprising an acrylate, a phosphate, a sulfonate, or any combination thereof, to form an etch mask on the activated metallic object by reaction of the polymeric component with the metal ions, the etch mask defining covered and uncovered portions of the metallic object; and
performing an etching process to remove portions of the metallic object that are not covered by the etch mask to form the metallic pattern.