US 12,270,106 B2
Substrate retaining apparatus, system including the apparatus, and method of using same
Shiva K. T. Rajavelu Muralidhar, Tempe, AZ (US); Sam Kim, Chandler, AZ (US); Jeffrey Barrett Robinson, Chandler, AZ (US); James King Wilson, Jr., Gilbert, AZ (US); and Ninad Vijay Sonje, Thane (IN)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Jan. 3, 2024, as Appl. No. 18/402,969.
Application 18/402,969 is a continuation of application No. 16/584,283, filed on Sep. 26, 2019, granted, now 11,885,023.
Claims priority of provisional application 62/739,733, filed on Oct. 1, 2018.
Prior Publication US 2024/0133035 A1, Apr. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/687 (2006.01)
CPC C23C 16/466 (2013.01) [C23C 16/4411 (2013.01); C23C 16/4586 (2013.01); H01L 21/67201 (2013.01); H01L 21/68757 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate retaining apparatus comprising:
a baseplate;
at least one sidewall coupled to the baseplate, wherein the at least one sidewall comprises at least one cooling fluid conduit, configured to allow a liquid cooling fluid to flow there through, and at least one gas conduit;
at least one pad coupled to and projecting from a sidewall of the at least one sidewall, the at least one pad configured to receive a substrate; and
at least one heat shield coupled to at least one of the at least one sidewall, wherein the at least one heat shield comprises a top surface, a bottom surface, and at least one opening on the bottom surface of the at least one heat shield, the at least one opening is fluidly coupled to the at least one gas conduit in the at least one sidewall, wherein the at least one opening is formed within the at least one heat shield.