	US 12,269,964 B2
	Protective coating composition for electronic board and method of preparing same
Tae Seung Lee, Gyeonggi-do (KR); Yong Cheol Kim, Seoul (KR); Chang Su Yoo, Gyeonggi-do (KR); Jun Ho Lee, Gyeonggi-do (KR); and Eun Su Yun, Chungcheongnam-do (KR)
Assigned to Hyundai Motor Company, Seoul (KR); and Kia Corporation, Seoul (KR)
Filed by Hyundai Motor Company, Seoul (KR); and Kia Corporation, Seoul (KR)
Filed on Oct. 19, 2022, as Appl. No. 17/969,096.
Claims priority of application No. 10-2021-0140451 (KR), filed on Oct. 20, 2021.
Prior Publication US 2023/0119754 A1, Apr. 20, 2023
Int. Cl. C09D 175/04 (2006.01); C08J 7/052 (2020.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/65 (2018.01); C09D 183/04 (2006.01); H05K 3/28 (2006.01)

CPC C09D 175/04 (2013.01) [C08J 7/052 (2020.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/65 (2018.01); C09D 183/04 (2013.01); H05K 3/282 (2013.01); C08J 2375/04 (2013.01); C08J 2383/04 (2013.01)]

19 Claims

1. A protective coating composition for an electronic board, comprising:

a first resin comprising a first urethane-modified alkyd resin;

a second resin synthesized through a polymerization of second urethane-modified alkyd resin and a silicone resin;

a solvent comprising carbon-based solvents, ketone-based solvents, alcohol-based solvents, or combinations thereof;

a fluidity control agent; and

a metal catalyst,

the protective coating composition optionally comprising a flame retardant,

wherein the fluidity control agent comprises a micronized calcium dispersion, urea-modified polyimide, or combinations thereof.