US 12,269,943 B2
Liquid resin composition for sealing and electronic component device
Yuma Takeuchi, Tokyo (JP); Hisato Takahashi, Tokyo (JP); and Hiroyoshi Deguchi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/300,101
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed May 11, 2016, PCT No. PCT/JP2016/064053
§ 371(c)(1), (2) Date Nov. 9, 2018,
PCT Pub. No. WO2017/195304, PCT Pub. Date Nov. 16, 2017.
Prior Publication US 2019/0144660 A1, May 16, 2019
Int. Cl. C08L 63/00 (2006.01); C08G 59/50 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08L 53/00 (2006.01); C08L 67/02 (2006.01)
CPC C08L 63/00 (2013.01) [C08G 59/50 (2013.01); C08G 59/5033 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); C08L 53/00 (2013.01); C08L 67/02 (2013.01); C08L 2203/20 (2013.01)] 19 Claims
 
1. A liquid resin composition for sealing, comprising:
an epoxy resin (A) having an epoxy equivalent weight of from 80 g/eq to 250 g/eq;
a curing agent (B) containing at least one amino group in a molecule;
a polymer resin (C) comprising at least one selected from the group consisting of a phenol resin, a phenoxy resin having an epoxy equivalent weight of 3,000 g/eq or more and a polyvinyl alcohol; and
an inorganic filler (D),
wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more,
wherein a content of the polymer resin (C) is from 0.05% by mass to 2.6% by mass with respect to a total solid content and a content of the inorganic filler (D) is from 46% by mass to 85% by mass with respect to the total solid content, wherein the total solid content is a residue obtained by removing a volatile component from the liquid resin composition for sealing, and
wherein the liquid resin composition for sealing has a viscosity from 11 Pa·s to 100.0 Pa·s at 25° C.