US 12,269,924 B2
Polyimide film and manufacturing method thereof
Bo Hung Lai, Tainan (TW); Wei Che Tang, Tainan (TW); and Tang Chieh Huang, Tainan (TW)
Assigned to MICROCOSM TECHNOLOGY CO., LTD., Tainan (TW)
Appl. No. 17/623,397
Filed by MICROCOSM TECHNOLOGY CO., LTD., Tainan (TW)
PCT Filed May 14, 2020, PCT No. PCT/CN2020/090321
§ 371(c)(1), (2) Date Dec. 28, 2021,
PCT Pub. No. WO2021/226951, PCT Pub. Date Nov. 18, 2021.
Prior Publication US 2022/0372227 A1, Nov. 24, 2022
Int. Cl. C08G 73/10 (2006.01); C08J 7/04 (2020.01); C08L 79/08 (2006.01)
CPC C08G 73/1064 (2013.01) [C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08J 7/0427 (2020.01); C08L 79/08 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01); C08L 2203/206 (2013.01)] 7 Claims
 
1. A polyimide film, comprising a polyimide having a structure represented by formula (I):

OG Complex Work Unit Chemistry
wherein A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R1 is a residue group of an aromatic dianhydride, R2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film, and
wherein the aromatic diamine containing the sulfonyl group comprises 4,4′-bis(3-aminophenoxy) diphenyl sulfone, or 4,4′-bis(4-aminophenoxy) diphenyl sulfone.