US 12,269,733 B2
Inertial sensor and method for manufacturing the same
Keitaro Ito, Nisshin (JP); Shota Harada, Nisshin (JP); Katsuaki Goto, Nisshin (JP); Yuuki Inagaki, Nisshin (JP); Teruhisa Akashi, Nisshin (JP); Hirofumi Funabashi, Nisshin (JP); Takahiko Yoshida, Nisshin (JP); and Yusuke Kawai, Nisshin (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Mar. 24, 2022, as Appl. No. 17/703,418.
Claims priority of application No. 2021-057615 (JP), filed on Mar. 30, 2021; and application No. 2021-174533 (JP), filed on Oct. 26, 2021.
Prior Publication US 2022/0315411 A1, Oct. 6, 2022
Int. Cl. B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81C 3/00 (2006.01)
CPC B81B 3/0021 (2013.01) [B81C 3/001 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81C 2203/0172 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An inertial sensor comprising:
a micro vibration body that is a thin-walled member having a front surface, which is a surface on a side having a large outer diameter, and a back surface, which is an opposite surface to the front surface and having a smaller diameter than the front surface, the micro vibration body including a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion toward the back surface;
a mounting substrate that includes a lower substrate and an upper substrate, which are joined to each other, the upper substrate including an inner frame portion, which has a frame-shape, and a plurality of electrode portions, which are separated from each other and surround an inner frame portion; and
a joining member that is provided in an inner region of the mounting substrate, which is surrounded by the inner frame portion, wherein
the recessed portion of the micro vibration body has a bottom surface defining a mounted surface on a side of the back surface,
the mounted surface is located in the inner region and is joined to the mounting substrate via the joining member,
the curved surface portion has a rim that is in a hollow state,
the rim is a part of the curved surface portion and includes an end portion of the curved surface portion on an opposite side to the recessed portion,
the rim has a rim lower surface, which is a surface connecting the front surface with the back surface, and
the rim lower surface is located on a same plane as the mounted surface or a tip end portion of the mounted surface.