US 12,269,273 B2
Substrate treating liquid supply unit and substrate treating apparatus including the same
Dong Hwa Lee, Chungcheongnam-do (KR); Dai Geon Yoon, Chungcheongnam-do (KR); Soo Hong Lee, Gyeonggi-do (KR); Ji Hyeon Kim, Chungcheongnam-do (KR); and Dae Sung Kim, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Jun. 28, 2022, as Appl. No. 17/851,029.
Claims priority of application No. 10-2021-0099084 (KR), filed on Jul. 28, 2021.
Prior Publication US 2023/0031300 A1, Feb. 2, 2023
Int. Cl. B41J 2/175 (2006.01)
CPC B41J 2/17556 (2013.01) [B41J 2/17566 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate treating liquid supply unit comprising:
a first reservoir connected to an inkjet head unit for jetting a substrate treating liquid onto a substrate and configured to provide the substrate treating liquid to the inkjet head unit;
a water level sensor configured to measure a water level of the substrate treating liquid stored in the first reservoir;
a pressure control module configured to compensate for a pressure provided to the first reservoir based on an amount variation in the water level of the substrate treating liquid stored in the first reservoir; and
a second reservoir connected to the first reservoir and supplementing the substrate treating liquid to the first reservoir,
wherein the pressure control module includes:
a control board calculating the pressure provided to the first reservoir based on a reference value and a measurement value of the water level sensor, and
a pressure providing unit compensating for the pressure provided to the first reservoir based on a calculated value,
wherein the water level sensor is installed on an outer side surface of the first reservoir with a height direction of the first reservoir as a length direction thereof to measure the water level of the substrate treating liquid stored in the first reservoir, and
wherein the control board is configured to, when the pressure providing unit does not operate normally, control the second reservoir such that a flow rate corresponding to a pressure compensation value is supplied to the first reservoir.