| CPC B24B 29/02 (2013.01) [B24B 7/242 (2013.01); B24B 27/0076 (2013.01); B24B 41/047 (2013.01); B24B 41/0475 (2013.01)] | 17 Claims |

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1. A substrate polishing apparatus, comprising:
a stage having a flat surface, which is parallel to a first direction and a second direction, and configured to support a substrate;
a pressing unit configured to exert a pressure on the substrate in a third direction perpendicular to the first and second directions at a position overlapping the stage;
a rotary unit connected to the pressing unit, the rotary unit being configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view;
a plurality of polishing pads provided between the pressing unit and the substrate and used to polish the substrate; and
a nozzle part configured to supply a slurry onto the substrate,
wherein:
the polishing pads are spaced apart from each other in a direction parallel to a motion of the substrate;
when measured in the second direction, a length of each of the polishing pads is greater than a length of the substrate;
each of the polishing pads has a rectangular shape in a plan view;
the rotary unit comprises a body part and a rotary part that executes a circular motion about the central axis with respect to the body part;
the rotary part includes a rectangular portion that is longer in the second direction than the first direction;
the body part defines a ring-shaped groove on a surface thereof facing the third direction; and
wherein the rotary part includes a circular portion coupled to the body part so as to be movable within the ring-shaped groove.
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