US 12,269,116 B2
Laser treatment system and method
Laure Lavoute, Isle (FR); Dmitriy Gaponov, Limoges (FR); Marc Castaing, Isle (FR); Nicolas Ducros, Bosmie l'aiguille (FR); and Olivier Jeannin, Grenoble (FR)
Assigned to Aledia, Champagnier (FR); and Leukos, Limoges (FR)
Appl. No. 17/630,876
Filed by Aledia, Echirolles (FR); and Leukos, Limoges (FR)
PCT Filed Jul. 21, 2020, PCT No. PCT/EP2020/070502
§ 371(c)(1), (2) Date Jan. 27, 2022,
PCT Pub. No. WO2021/018661, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 1908743 (FR), filed on Jul. 31, 2019.
Prior Publication US 2022/0266384 A1, Aug. 25, 2022
Int. Cl. B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 101/40 (2006.01); G02B 3/04 (2006.01)
CPC B23K 26/0648 (2013.01) [B23K 26/0622 (2015.10); G02B 3/04 (2013.01); B23K 2101/40 (2018.08)] 13 Claims
OG exemplary drawing
 
1. System comprising:
an object comprising a substrate, a region to be treated adjacent to the substrate, and an element to be detached adjacent to the region and opposite to the substrate;
a source of an incident laser beam configured to deliver a focused laser beam, said system being configured so that the wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of the wavelength associated with the bandgap of the material forming the substrate; and
an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device,
said treatment being performed on said region adjacent to the substrate and opposite to the optical device, that is, through the whole substrate, and comprising the physical, chemical, or physico-chemical modification or the ablation of said region which results in the detachment of the element,
and wherein said source is adapted to delivering at least one pulse of the incident laser beam, the duration of said at least one pulse being in the range from 0.1 ps and 1000 ps.