US 12,269,109 B2
Wire bonding capillary
Jeffrey C. Roberts, Elk Grove Village, IL (US); and Jeffrey Taylor, Elk Grove Village, IL (US)
Assigned to CRAFTSTECH, INC.
Appl. No. 18/041,315
Filed by CRAFTSTECH, INC., Elk Grove Village, IL (US)
PCT Filed Aug. 19, 2021, PCT No. PCT/US2021/046635
§ 371(c)(1), (2) Date Feb. 10, 2023,
PCT Pub. No. WO2022/040394, PCT Pub. Date Feb. 24, 2022.
Claims priority of provisional application 63/068,231, filed on Aug. 20, 2020.
Prior Publication US 2023/0311239 A1, Oct. 5, 2023
Int. Cl. B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01)
CPC B23K 20/007 (2013.01) [H01L 24/78 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/78306 (2013.01); H01L 2224/78309 (2013.01); H01L 2924/40 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A wire bonding capillary, consisting of:
a sleeve having a cavity; and
a core consisting of a composite, the composite consisting of diamond greater than 79 vol. % and a binder consisting of silicon carbide placed in the cavity of the sleeve, the core having a passageway therethrough for passage of a wire,
wherein the core has a hardness greater than a hardness of the sleeve.