| CPC B08B 3/02 (2013.01) [B08B 3/08 (2013.01); B08B 7/0014 (2013.01)] | 10 Claims |
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1. A substrate processing method comprising:
a processing liquid supplying step which supplies a processing liquid to a surface of a substrate;
a processing film forming step in which the processing liquid on the surface of the substrate is solidified or cured to form a processing film that holds removal objects present on the surface of the substrate; and
a removing step in which a removing liquid is supplied to the surface of the substrate, after the processing film forming step, to thereby remove the processing film from the surface of the substrate in a state that the removal objects are held by the processing film such that the processing film in the state of holding the removal objects is pushed to outside of the substrate, wherein
the processing liquid contains a dissolution component which dissolves at least one of a front layer of the substrate and the removal objects as a dissolution object, a high solubility component, and a low solubility component which is less likely to be dissolved in the removing liquid than the high solubility component,
the high solubility component forms, in the processing film forming step, a high solubility solid which is the dissolution component in a solid state, and at least some of the high solubility solid is locally present and extends in the processing film from the surface of the processing film to the surface of the substrate,
the low solubility component forms, in the processing film forming step, a low solubility solid which is the low solubility component in a solid state,
the dissolution object includes at least the removal objects,
the removal objects include a removal film which covers at least a part of the surface of the substrate,
the processing liquid supplying step includes a dissolution step which partially dissolves the dissolution object by the dissolution component in the processing liquid supplied to the surface of the substrate,
in the dissolution step, the removal film is partially dissolved by the dissolution component in the processing liquid so as to be split into film fragments,
the processing film formed in the processing film forming step holds the film fragments of the removal film, and
in the removing step, the removing liquid dissolves the low solubility solid in a vicinity of the surface of the substrate, and enters a gap between the processing film and the surface of the substrate, thereby to peel the processing film from the substrate in a state of holding the film fragments of the removal film.
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