US 12,269,062 B2
Ultrasonic device
Chikara Kojima, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jun. 23, 2021, as Appl. No. 17/356,102.
Claims priority of application No. 2020-112699 (JP), filed on Jun. 30, 2020.
Prior Publication US 2021/0402435 A1, Dec. 30, 2021
Int. Cl. B06B 1/06 (2006.01); G01B 17/02 (2006.01); G01S 15/08 (2006.01)
CPC B06B 1/0603 (2013.01) [G01B 17/02 (2013.01); G01S 15/08 (2013.01); B06B 1/0607 (2013.01); B06B 1/0629 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An ultrasonic device, comprising:
a substrate;
a transmitter at the substrate, wherein the transmitter is configured to transmit an ultrasonic wave to an object; and
a receiver at a position different from a position of the transmitter at the substrate, wherein
the receiver is configured to receive an ultrasonic wave reflected by the object,
the substrate has a transmission opening corresponding to the position of the transmitter and a reception opening corresponding to the position of the receiver,
a width of each of the transmission opening and the reception opening is set such that a resonance frequency of the transmitter is higher than a resonance frequency of the receiver, and an anti-resonance frequency of the receiver is in a predetermined frequency band including the resonance frequency of the transmitter, and
the resonance frequency of the receiver is lower than a lower limit of the predetermined frequency band including the resonance frequency of the transmitter.