US 12,269,061 B2
Bottom electrode via structures for micromachined ultrasonic transducer devices
Lingyun Miao, Fremont, CA (US); and Jianwei Liu, Fremont, CA (US)
Assigned to BFLY Operations, Inc, Burlington, MA (US)
Filed by BFLY OPERATIONS, INC., Burlington, MA (US)
Filed on Oct. 4, 2023, as Appl. No. 18/376,598.
Application 18/376,598 is a continuation of application No. 17/953,155, filed on Sep. 26, 2022, granted, now 11,806,747.
Application 17/953,155 is a continuation of application No. 16/844,857, filed on Apr. 9, 2020, granted, now 11,484,911, issued on Nov. 1, 2022.
Claims priority of provisional application 62/833,625, filed on Apr. 12, 2019.
Prior Publication US 2024/0024917 A1, Jan. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B06B 1/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01)
CPC B06B 1/0292 (2013.01) [B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/0125 (2013.01); B81C 2201/013 (2013.01); B81C 2203/036 (2013.01); B81C 2203/0735 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An ultrasound transducer device, comprising:
an electrode;
a membrane separated from the electrode by a cavity between the membrane and the electrode;
a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane; and
vias that electrically connect the electrode to a substrate;
wherein the vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surf ace of the patterned membrane support layer, in a plan view; and
wherein an interface between the membrane and the patterned membrane support layer has a surface roughness of less than one nanometer over a distance of 100 micrometers.